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MC33879 数据表(PDF) 4 Page - Motorola, Inc |
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MC33879 数据表(HTML) 4 Page - Motorola, Inc |
4 / 20 page 33879 MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA 4 MAXIMUM RATINGS All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit VDD Supply Voltage (Note 1) VDD -0.3 to 7.0 VDC CS , DI, DO, SCLK, IN5, IN6, and EN (Note 1) – -0.3 to 7.0 VDC VPWR Supply Voltage (Note 1) VPWR -16 to 40 VDC Output Clamp Energy (Note 2) ECLAMP 50 mJ ESD Voltage Human Body Model (Note 3) Machine Model (Note 4) VESD1 VESD2 ±2000 ±200 V Storage Temperature TSTG -55 to 150 °C Operating Case Temperature TC -40 to 125 °C Operating Junction Temperature TJ -40 to 150 °C Maximum Junction Temperature TJ -40 to 150 °C Power Dissipation (Note 5) PD 1.7 W Thermal Resistance Junction-to-Ambient Between the Die and the Exposed Die Pad RθJA RθJC 71 1.2 °C/W Notes 1. Exceeding these limits may cause malfunction or permanent damage to the device. 2. Maximum output clamp energy capability at 150 °C junction temperature using single non-repetitive pulse method with I = 350 mA. 3. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω). 4. ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω). 5. Maximum power dissipation at TA = 25°C with no heatsink used. Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com |
类似零件编号 - MC33879 |
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类似说明 - MC33879 |
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