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ADT7410 数据表(PDF) 6 Page - Analog Devices

部件名 ADT7410
功能描述  16-Bit Digital I2C Temperature Sensor
Download  25 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADT7410 数据表(HTML) 6 Page - Analog Devices

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Data Sheet
ADT7410
Rev. C | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Rating
VDD to GND
−0.3 V to +7 V
SDA Voltage to GND
−0.3 V to VDD + 0.3 V
SCL Output Voltage to GND
−0.3 V to VDD + 0.3 V
A0 Input Voltage to GND
−0.3 V to VDD + 0.3 V
A1 Input Voltage to GND
−0.3 V to VDD + 0.3 V
CT and INT Output Voltage to GND
−0.3 V to VDD + 0.3 V
ESD Rating (Human Body Model)
2.0 kV
Operating Temperature Range
−55°C to +150°C
Storage Temperature Range
−65°C to +160°C
Maximum Junction Temperature, TJMAX
150°C
8-Lead SOIC-N (R-8)
Power Dissipation1
WMAX = (TJMAX − TA2)/θJA
Thermal Impedance3
θJA, Junction-to-Ambient (Still Air)
121°C/W
θJC, Junction-to-Case
56°C/W
IR Reflow Soldering
220°C
Peak Temperature (RoHS-Compliant
Package)
260°C (0°C)
Time at Peak Temperature
20 sec to 40 sec
Ramp-Up Rate
3°C/sec maximum
Ramp-Down Rate
−6°C/sec maximum
Time from 25°C to Peak Temperature
8 minutes maximum
1
Values relate to package being used on a standard 2-layer PCB. This gives a
worst-case θJA and θJC. See Figure 3 for a plot of maximum power dissipation
vs. ambient temperature (TA).
2
TA = ambient temperature.
3
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient is more useful for air-cooled, PCB-mounted
components.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
TEMPERATURE (°C)
1.2
0.8
1.0
0.6
0.2
0.4
0
MAX PD = 3.4mW AT 150°C
Figure 3. SOIC_N Maximum Power Dissipation vs. Temperature
ESD CAUTION


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