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DRV5032FCDBZT 数据表(PDF) 32 Page - Texas Instruments |
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DRV5032FCDBZT 数据表(HTML) 32 Page - Texas Instruments |
32 / 34 page www.ti.com EXAMPLE BOARD LAYOUT 0.05 MIN ALL AROUND 0.05 MAX ALL AROUND (0.6) (1.4) 4X (0.22) (0.8) ( ) VIA 0.2 4X (0.4) (R ) TYP 0.05 2X (0.5) X2SON - 0.4 mm max height DMR0004A PLASTIC SMALL OUTLINE - NO LEAD 4222825/A 03/2016 SYMM 1 2 3 4 SYMM LAND PATTERN EXAMPLE SCALE:35X 5 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If all or some are implemented, recommended via locations are shown. It is recommended that vias under paste be filled, plugged or tented. SOLDER MASK OPENING SOLDER MASK METAL UNDER SOLDER MASK DEFINED METAL SOLDER MASK OPENING SOLDER MASK DETAILS NON SOLDER MASK DEFINED (PREFERRED) |
类似零件编号 - DRV5032FCDBZT |
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类似说明 - DRV5032FCDBZT |
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