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LM2623QNHLRQ1 数据表(PDF) 4 Page - Texas Instruments |
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LM2623QNHLRQ1 数据表(HTML) 4 Page - Texas Instruments |
4 / 20 page 4 LM2623-Q1 SNVSAO5 – OCTOBER 2017 www.ti.com Product Folder Links: LM2623-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office / Distributors for availability and specifications. (3) The maximum power dissipation must be derated at elevated temparters and is dictated by TJ-MAX (maximum junction temperature), RΘJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD-MAX = (TJ-MAX – TA)/RΘJA or the number given in the Absolute Maximum Rating, whichever is lower. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Input pins SW pin voltage –0.5 14.5 V BOOT, VDD, EN, and FB pins –0.5 10 V FREQ pin 100 µA Power dissipation (TA = 25°C) (3) 500 mW TJ_MAX (3) 150 °C Storage temperature, Tstg –55 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) All pins except 12 and 13 ±2000 V Pins 12 and 13 ±1000 Charged device model (CDM), per AEC Q100-011 ±500 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Input pins VDD pin 3 5 V FB and EN pins 0 VDD V BOOT pin 0 10 V Operating junction temperature range, TJ –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) LM2623-Q1 UNIT NHL (WSON) 14 PINS RθJA Junction-to-ambient thermal resistance 37.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 26.9 °C/W RθJB Junction-to-board thermal resistance 15.0 °C/W ψJT Junction-to-top characterization parameter 0.3 °C/W ψJB Junction-to-board characterization parameter 4.7 °C/W |
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