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SN74LVC2G06DBVR 数据表(PDF) 1 Page - Texas Instruments

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部件名 SN74LVC2G06DBVR
功能描述  DUAL INVERTER BUFFER/DRIVER WITH OPEN DRAIN OUTPUTS
Download  12 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

SN74LVC2G06DBVR 数据表(HTML) 1 Page - Texas Instruments

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SN74LVC2G06
DUAL INVERTER BUFFER/DRIVER
WITH OPENDRAIN OUTPUTS
SCES307E − AUGUST 2001 − REVISED SEPTEMBER 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Available in the Texas Instruments
NanoStar
 and NanoFree Packages
D Supports 5-V VCC Operation
D Max tpd of 3.4 ns at 3.3 V
D Low Power Consumption, 10-µA Max ICC
D ±24-mA Output Drive at 3.3 V
D Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
D Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
D Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V
D Ioff Supports Partial-Power-Down Mode
Operation
D Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
description/ordering information
This dual inverter buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
The output of the SN74LVC2G06 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
ORDERING INFORMATION
TA
PACKAGE†
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING‡
NanoStar
 − WCSP (DSBGA)
0.17-mm Small Bump − YEA
SN74LVC2G06YEAR
−40
°C to 85°C
NanoFree
 − WCSP (DSBGA)
0.17-mm Small Bump − YZA (Pb-free)
Tape and reel
SN74LVC2G06YZAR
_ _ _CT_
−40
°C to 85°C
NanoStar
 − WCSP (DSBGA)
0.23-mm Large Bump − YEP
Tape and reel
SN74LVC2G06YEPR
_ _ _CT_
NanoFree
 − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
SN74LVC2G06YZPR
−40
°C to 85°C
SOT (SOT-23) − DBV
Tape and reel
SN74LVC2G06DBVR
C06_
−40
°C to 85°C
SOT (SC-70) − DCK
Tape and reel
SN74LVC2G06DCKR
CT_
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition
(1 = SnPb,
= Pb-free).
Copyright
 2003, Texas Instruments Incorporated
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
6
5
4
1A
GND
2A
1Y
VCC
2Y
3
2
1
4
5
6
2A
GND
1A
2Y
VCC
1Y
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
NanoStar and NanoFree are trademarks of Texas Instruments.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.


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