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SN74LVC2G06DBVR 数据表(PDF) 1 Page - Texas Instruments |
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SN74LVC2G06DBVR 数据表(HTML) 1 Page - Texas Instruments |
1 / 12 page SN74LVC2G06 DUAL INVERTER BUFFER/DRIVER WITH OPENDRAIN OUTPUTS SCES307E − AUGUST 2001 − REVISED SEPTEMBER 2003 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Available in the Texas Instruments NanoStar and NanoFree Packages D Supports 5-V VCC Operation D Max tpd of 3.4 ns at 3.3 V D Low Power Consumption, 10-µA Max ICC D ±24-mA Output Drive at 3.3 V D Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C D Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C D Inputs and Open-Drain Outputs Accept Voltages up to 5.5 V D Ioff Supports Partial-Power-Down Mode Operation D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II D ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) description/ordering information This dual inverter buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G06 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING‡ NanoStar − WCSP (DSBGA) 0.17-mm Small Bump − YEA SN74LVC2G06YEAR −40 °C to 85°C NanoFree − WCSP (DSBGA) 0.17-mm Small Bump − YZA (Pb-free) Tape and reel SN74LVC2G06YZAR _ _ _CT_ −40 °C to 85°C NanoStar − WCSP (DSBGA) 0.23-mm Large Bump − YEP Tape and reel SN74LVC2G06YEPR _ _ _CT_ NanoFree − WCSP (DSBGA) 0.23-mm Large Bump − YZP (Pb-free) SN74LVC2G06YZPR −40 °C to 85°C SOT (SOT-23) − DBV Tape and reel SN74LVC2G06DBVR C06_ −40 °C to 85°C SOT (SC-70) − DCK Tape and reel SN74LVC2G06DCKR CT_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Copyright 2003, Texas Instruments Incorporated DBV OR DCK PACKAGE (TOP VIEW) 1 2 3 6 5 4 1A GND 2A 1Y VCC 2Y 3 2 1 4 5 6 2A GND 1A 2Y VCC 1Y YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) NanoStar and NanoFree are trademarks of Texas Instruments. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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类似说明 - SN74LVC2G06DBVR |
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