1

4

2

3

GND

SEL

OUT

Thermal

Pad

3

DRV5012

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SLVSDD5 – AUGUST 2017

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5 Pin Configuration and Functions

DMR Package

4-Pin X2SON With Exposed Thermal Pad

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

GND

2

—

Ground reference

OUT

3

O

SEL

4

I

CMOS input that selects the sampling rate: a low voltage sets 20 Hz; a high voltage sets 2.5 kHz.

1

—

1.65-V to 5.5-V power supply. TI recommends connecting this pin to a ceramic capacitor to ground

with a value of at least 0.1 µF.

Thermal

Pad

PAD

—

No-connect. This pin should be left floating or tied to ground. It should be soldered to the board for

mechanical support.

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Power supply voltage

–0.3

5.5

V

Power supply voltage slew rate

Unlimited

V / µs

Output voltage

OUT

–0.3

V

Output current

OUT

–5

5

mA

Input voltage

SEL

–0.3

V

Unlimited

T

105

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±6000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±750