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HCPL-5301 数据表(PDF) 2 Page - Broadcom Corporation.

部件名 HCPL-5301
功能描述  Intelligent Power Module and Gate Drive Interface Hermetically Sealed Optocouplers
Download  16 Pages
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制造商  BOARDCOM [Broadcom Corporation.]
网页  http://www.broadcom.com
标志 BOARDCOM - Broadcom Corporation.

HCPL-5301 数据表(HTML) 2 Page - Broadcom Corporation.

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Broadcom
- 2 -
HCPL-5300, HCPL-5301, HCPL-530K, 5962-96852
Data Sheet
Schematic Diagram
Schematic Diagram
NOTE
The connection of a 0.1-μF bypass capacitor
between pins 5 and 8 is recommended.
Selection Guide–Lead Configuration
Options
Truth Table
LED
VO
ON
L
OFF
H
8
7
6
1
3
SHIELD
5
2
4
20 k
Part Numbers and Options
Commercial
HCPL-5300
MIL-PRF-38534, Class H
HCPL-5301
MIL-PRF-38534, Class K
HCPL-530K
Standard Lead Finisha
a.
Gold Plate lead finish: Maximum gold thickness of leads is <100
micro inches. Typical is 60 to 90 micro inches.
Gold Plate
Solder Dippedb
b.
Solder lead finish: Sn63/Pb37.
Option #200
Butt Cut/Gold Platea
Option #100
Gull Wing/Solderedb
Option #300
Class H SMD Part #
Prescript for all below
5962-
Gold Platea
9685201HPC
Solder Dippedb
9685201HPA
Butt Cut/Gold Platea
9685201HYC
Butt Cut/Solderedb
9685201HYA
Gull Wing/Solderedb
9685201HXA
Class K SMD Part #
Prescript for all below
5962-
Gold Platea
9685201KPC
Solder Dippedb
9685201KPA
Butt Cut/Gold Platea
9685201KYC
Butt Cut/Solderedb
9685201KYA
Gull Wing/Solderedb
9685201KXA
Outline Drawing
8-Pin DIP, Through Hole, 1 Channel
3.81 (0.150)
MIN.
4.32 (0.170)
MAX.
10.03 (0.395)
10.29 (0.405)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
1.02 (0.040)
1.52 (0.060)
8.13 (0.320)
MAX.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
7.16 (0.282)
7.57 (0.298)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).


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