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LSBKS9UG42292-R2-W88 数据表(PDF) 7 Page - LIGITEK electronics co., ltd. |
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LSBKS9UG42292-R2-W88 数据表(HTML) 7 Page - LIGITEK electronics co., ltd. |
7 / 7 page PART NO. Test Item Reliability Test: Operating Life Test Low Temperature Storage Test High Temperature Storage Test High Temperature High Humidity Test Thermal Shock Test Solderability Test Solder Resistance Test MIL-STD-883:1008 JIS C 7021: B-10 The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 The purpose of this test is the resistance of the device under tropical for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Test Condition MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/6 LSBKS9UG42292/R2-W88 |
类似零件编号 - LSBKS9UG42292-R2-W88 |
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类似说明 - LSBKS9UG42292-R2-W88 |
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