Electrical specifications

L9301

10/51

DocID028688 Rev 6

3.3

Operating range

3.4

Thermal data

Figure 3. Device assembled on 2s2p PCB with high density vias in contact with a metal plate

Table 5. Operating range

Symbol

Parameter

Min.

Max.

Unit

VB

Supply voltage

VB_UV

18

V

VDD

Stabilized supply voltage

VDD_UV

VDD_OV

V

VDD_IO

Logic output supply voltage

3.0

5.5

V

Table 6. Thermal data

Symbol

Parameter

Min.

Typ.

Max.

Unit

Operating ambient temperature

-40

-

125

°C

Storage temperature

-40

-

150

°C

Junction temperature

-40

-

175

°C

Thermal shutdown temperature

180

-

195

°C

Thermal shutdown temperature hysteresis

-

10

-

°C

Table 7. Thermal resistance

Symbol

Parameter

Working conditions

Value

Unit

Junction to ambient

27

°C/W

8

°C/W

1

°C/W

Junction to top case

21

°C/W

Psi Junction to top case

2s2p (4L) board; Natural convection (1)

2

°C/W

1. Jedec STD. JESD51.

2. Package assembled on 2s2p (4L) board. The board bottom side is in contact with a metal plate as per typical automotive

application (ECU system). See Figure 3.

3. Thermal resistance between the die and the bottom case surface in ideal contact and measured by cold plate as per Jedec

best practice guidelines (JESD51).

4. Thermal resistance between the die and the top case surface in ideal contact and measured by cold plate as per Jedec

best practice guidelines (JESD51).