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DDC232CGXGR Datasheet(数据表) 28 Page - Texas Instruments

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部件型号  DDC232CGXGR
说明  32-Channel, Current-Input Analog-to-Digital Converter
下载  34 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
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DDC232CGXGR Datasheet(HTML) 28 Page - Texas Instruments

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 28 page
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PACKAGE OPTION ADDENDUM
www.ti.com
15-Apr-2017
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C)
Device Marking
(4/5)
Samples
201-000795
ACTIVE
NFBGA
ZXG
64
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 70
DDC232
DDC232CGXGR
ACTIVE
NFBGA
GXG
64
1000
TBD
SN/PB
Level-3-240C-168 HR
0 to 70
DDC232
DDC232CGXGT
ACTIVE
NFBGA
GXG
64
250
TBD
SN/PB
Level-3-240C-168 HR
0 to 70
DDC232
DDC232CKZXGR
ACTIVE
NFBGA
ZXG
64
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 70
DDC232K
DDC232CKZXGT
ACTIVE
NFBGA
ZXG
64
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 70
DDC232K
DDC232CZXGR
ACTIVE
NFBGA
ZXG
64
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 70
DDC232
DDC232CZXGT
ACTIVE
NFBGA
ZXG
64
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
0 to 70
DDC232
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.




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