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SMP-QFN-8012 数据表(PDF) 2 Page - Ironwood Electronics. |
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SMP-QFN-8012 数据表(HTML) 2 Page - Ironwood Electronics. |
2 / 4 page 15.23 SOCKET BASE 0.50 TYP 1.71±0.10 (x4) NON-PLATED MOUNTING HOLE 0.85 (x2) NON-PLATED ALIGNMENT HOLE 17.73 Backing Plate CL 1.7 holes 0 and pads 6.3625 (x2) 1.2825 6.3625 (x2) 3.8225 3.25 (x14) 3.77 (x14) 3.25 (x14) 3.77 (x14) 3.34 3.34 A1 marking on socket base 0.45 x 0.30 Pads (56x) Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder Finish PCB Pad Height: Same or higher than solder mask *NOTE: PAD LAYOUT OFFSET WITH RESPECT TO CENTERLINE OF MOUNTING HOLES. PADS PATTERN IS SHIFTED 0.25MM TO THE RIGHT. Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Tolerances: Hole diameters ±0.03mm [±0.001"], Hole and pad positions ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. Description: Recommended PCB Layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. STATUS: Released REV. A DATE: 12/01/2015 Material: N/A Finish: N/A Weight: 10.99 SMP-QFN-8012 Drawing SCALE: 7:1 SHEET: 2 OF 4 ENG: M. A. Fedde FILE: SMP-QFN-8012 Dwg DRAWN BY: M. Raske |
类似零件编号 - SMP-QFN-8012 |
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类似说明 - SMP-QFN-8012 |
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