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SS-BGA400F-01 数据表(PDF) 4 Page - Ironwood Electronics. |
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SS-BGA400F-01 数据表(HTML) 4 Page - Ironwood Electronics. |
4 / 5 page PAGE 4 of 5 Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Status: Released Drawing: H. Hansen Scale: Rev: B Date: 5/7/04 Modified: File: SS-BGA400F-01 Dwg SS-BGA400F-01 Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com D E Y X Ø0.25 Ø0.10 Z X Y Øb 3 TOP VIEW SIDE VIEW 3 4 5 Dimensions are in millimeters. Interpret dimensions and toleraces per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plame Z. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. Parallelism measurement shall exclude any effect of mark on top surface of package. 1. 2. Co mpatible BGA Spec 0.20 BOTTOM VIEW DIM MIN MAX A 3.5 A1 0.5 0.7 b 0.90 D E e 27.00 BSC 27.00 BSC 1.27 BSC e 20x20 Array DETAIL A A1 DETAIL 0.2 Z Z 0.20 Z 5 4 |
类似零件编号 - SS-BGA400F-01 |
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类似说明 - SS-BGA400F-01 |
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