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HS-82C37 数据表(PDF) 28 Page - Harris Corporation

部件名 HS-82C37
功能描述  Radiation Hardened CMOS High Performance Programmable DMA Controller
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制造商  HARRIS [Harris Corporation]
网页  http://www.harris.com
标志 HARRIS - Harris Corporation

HS-82C37 数据表(HTML) 28 Page - Harris Corporation

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HS-82C37ARH
Spec Number
518058
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark. Alternately, a tab (dimension k)
may be used to identify pin one.
2. If a pin one identification mark is used in addition to a tab, the lim-
its of dimension k do not apply.
3. This dimension allows for off-center lid, meniscus, and glass
overrun.
4. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness. The maximum lim-
its of lead dimensions b and c or M shall be measured at the cen-
troid of the finished lead surfaces, when solder dip or tin plate
lead finish is applied.
5. N is the maximum number of terminal positions.
6. Measure dimension S1 at all four corners.
7. For bottom-brazed lead packages, no organic or polymeric mate-
rials shall be molded to the bottom of the package to cover the
leads.
8. Dimension Q shall be measured at the point of exit (beyond the
meniscus) of the lead from the body. Dimension Q minimum
shall be reduced by 0.0015 inch (0.038mm) maximum when sol-
der dip lead finish is applied.
9. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
10. Controlling dimension: INCH.
11. The basic lead spacing is 0.050 inch (1.27mm) between center
lines. Each lead centerline shall be located within
±0.005 inch
(0.13mm) of its exact longitudinal position relative to lead 1 and
the highest numbered (N) lead.
E
E1
D
S1
b
Q
E2
A
C
1
A
A
M
c1
b1
(c)
(b)
SECTION A-A
BASE
LEAD FINISH
METAL
M
e
N
L
K42.A TOP BRAZED
42 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.100
-
2.54
-
b
0.017
0.025
0.43
0.64
-
b1
0.017
0.023
0.43
0.58
-
c
0.007
0.013
0.18
0.33
-
c1
0.007
0.010
0.18
0.25
-
D
1.045
1.075
26.54
27.31
3
E
0.630
0.650
16.00
16.51
-
E1
-
0.680
-
17.27
3
E2
0.530
0.550
13.46
13.97
-
e
0.050 BSC
1.27 BSC
11
k
----
-
L
0.320
0.350
8.13
8.89
-
Q
0.045
0.065
1.14
1.65
8
S1
0.000
-
0.00
-
6
M
-
0.0015
-
0.04
-
N42
42
-
Rev. 0 6/17/94
Packaging


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