数据搜索系统,热门电子元器件搜索 |
|
SN74LVC1G06YEPR 数据表(PDF) 1 Page - Texas Instruments |
|
SN74LVC1G06YEPR 数据表(HTML) 1 Page - Texas Instruments |
1 / 12 page SN74LVC1G06 SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT SCES295N – JUNE 2000 – REVISED SEPTEMBER 2003 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Available in the Texas Instruments NanoStar and NanoFree Packages D Supports 5-V VCC Operation D Input and Open-Drain Output Accept Voltages Up To 5.5 V D Max tpd of 4 ns at 3.3 V D Low Power Consumption, 10-µA Max ICC D ±24-mA Output Drive at 3.3 V D Ioff Supports Partial-Power-Down Mode Operation D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II D ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) description/ordering information This single inverter buffer/driver is designed for 1.65-V to 5.5-V VCC operation. NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package. The output of the SN74LVC1G06 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING‡ –40 C to 85 C NanoStar – WCSP (DSBGA) 0.17-mm Small Bump – YEA Reel of 3000 SN74LVC1G06YEAR _ _ _CT_ –40 C to 85 C NanoFree – WCSP (DSBGA) 0.17-mm Small Bump – YZA (Pb-free) Reel of 3000 SN74LVC1G06YZAR _ _ _CT_ –40 C to 85 C NanoStar – WCSP (DSBGA) 0.23-mm Large Bump – YEP Reel of 3000 SN74LVC1G06YEPR _ _ _CT_ –40 °C to 85°C NanoFree – WCSP (DSBGA) 0.23-mm Large Bump – YZP (Pb-free) SN74LVC1G06YZPR SOT (SOT-23) – DBV Reel of 3000 SN74LVC1G06DBVR C06_ SOT (SOT-23) – DBV Reel of 250 SN74LVC1G06DBVT C06_ SOT (SC-70) – DCK Reel of 3000 SN74LVC1G06DCKR CT_ SOT (SC-70) – DCK Reel of 250 SN74LVC1G06DCKT CT_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Copyright 2003, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar and NanoFree are trademarks of Texas Instruments. DBV OR DCK PACKAGE (TOP VIEW) 1 2 3 5 4 NC A GND VCC Y DNU – Do not use 3 2 1 4 5 GND A DNU Y VCC YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) NC – No internal connection PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
类似零件编号 - SN74LVC1G06YEPR |
|
类似说明 - SN74LVC1G06YEPR |
|
|
链接网址 |
隐私政策 |
ALLDATASHEETCN.COM |
ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |