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ADP7183ACPZN1.2-R7 数据表(PDF) 5 Page - Analog Devices |
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ADP7183ACPZN1.2-R7 数据表(HTML) 5 Page - Analog Devices |
5 / 19 page Data Sheet ADP7183 Rev. 0 | Page 5 of 19 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VIN to GND +0.3 V to −6 V VOUT to GND +0.3 V to −VIN EN to GND +5.0 V to −6 V VA to GND +0.3 V to −6 V VAFB to GND +0.3 V to −6 V VREG to GND +0.3 V to −2.16 V SENSE to GND +0.3 V to −6 V Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL DATA Absolute maximum ratings apply individually only, not in combination. The ADP7183 can be damaged when the junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum ambient temperature may have to be derated. In applications with moderate power dissipation and low printed circuit board (PCB) thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction to ambient thermal resistance of the package (θJA). Use the following equation to calculate the junction temperature (TJ) from the ambient temperature (TA) and power dissipation (PD): TJ = TA + (PD × θJA) The junction to ambient thermal resistance (θJA) of the package is based on modeling and calculation using a 4-layer board. The junction to ambient thermal resistance is highly dependent on the application and board layout. In applications where high maximum power dissipation exists, close attention to thermal board design is required. The θJA value may vary, depending on the PCB material, layout, and environmental conditions. The specified θJA values are based on a 4-layer, 4 in. × 3 in. circuit board. THERMAL RESISTANCE Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. Table 4. Thermal Resistance Package Type θJA θJC Unit CP-8-271 68.8 10.0 °C/W 1 Thermal impedance simulated values are based on JEDEC 2S2P thermal test board with four thermal vias. See JEDEC JESD51. ESD CAUTION |
类似零件编号 - ADP7183ACPZN1.2-R7 |
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类似说明 - ADP7183ACPZN1.2-R7 |
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