AD8275

Rev. A | Page 4 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

18 V

Output Short-Circuit Current

See derating curve

(Figure 3)

Voltage at +IN, −IN Pins

and OUT Pins

Current into REFx, +IN, −IN, SENSE,

and OUT Pins

3 mA

Storage Temperature Range

−65°C to +130°C

Specified Temperature Range

−40°C to +85°C

135°C/W

Package Glass Transition Temperature

140°C

ESD Human Body Model

2 kV

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation in the AD8275 package is

the die. The plastic encapsulating the die locally reaches the

junction temperature. At approximately 140°C, which is the

glass transition temperature, the plastic changes its properties.

Even temporarily exceeding this temperature limit can change

the stresses that the package exerts on the die, permanently

shifting the parametric performance of the AD8275. Exceeding

a junction temperature of 140°C for an extended period can

result in changes in silicon devices, potentially causing failure.

The junction temperature is calculated as follows:

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

dissipated in the package and some of which is dissipated in the

The difference between the total drive power and the load

power is the drive power dissipated in the package.

(

)

L

OUT

L

OUT

S

S

S

D

R

V

R

V

V

I

V

P

2

–

2













×

+

×

=

addition, more metal directly in contact with the package leads

from metal traces, through holes, ground, and power planes

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature on a 4-layer JEDEC

standard board.

0

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

–40

0

–20

20

40

60

80

100

120

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Power Dissipation vs. Ambient Temperature

ESD CAUTION