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C1812C226M4RALTU 数据表(PDF) 11 Page - Kemet Corporation

部件名 C1812C226M4RALTU
功能描述  Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
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制造商  KEMET [Kemet Corporation]
网页  http://www.kemet.com
标志 KEMET - Kemet Corporation

C1812C226M4RALTU 数据表(HTML) 11 Page - Kemet Corporation

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1018_X7R_SnPb_SMD • 2/29/2016 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial “L” Series, SnPb Termination, X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection,
IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s
recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture
sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions.
Profile Feature
Termination Finish
SnPb
100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
100°C
150°C
Temperature Maximum (TSmax)
150°C
200°C
Time (tS) from TSmin to TSmax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second maximum 3°C/second maximum
Liquidous Temperature (TL)
183°C
217°C
Time Above Liquidous (tL)
60 – 150 seconds
60 – 150 seconds
Peak Temperature (TP)
235°C
260°C
Time Within 5°C of Maximum
Peak Temperature (tP)
20 seconds maximum 30 seconds maximum
Ramp-Down Rate (TP to TL) 6°C/second maximum 6°C/second maximum
Time 25°C to Peak
Temperature
6 minutes maximum
8 minutes maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Time
Tsmin
25° C to Peak
tL
tS
25
tP
Tsmax
TL
TP
Maximum Ramp Up Rate = 3°C/sec
Maximum Ramp Down Rate = 6°C/sec


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