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SL2309 数据表(PDF) 10 Page - Silicon Laboratories |
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SL2309 数据表(HTML) 10 Page - Silicon Laboratories |
10 / 13 page Rev 2.0, May 12, 2008 Page 10 of 12 SL2309 Package Drawing and Dimensions 16-Lead TSSOP (4.4-mm) 0.190(0.007) 0.300(0.012) 0.090(0.003) 0.200(0.008) 8 9 6.250(0.246) 6.500(0.256) 4.300(0.169) 4.500(0.177) 4.900(0.193) 5.100(0.200) 0.850(0.033) 0.950(0.037) 0.050(0.002) 0.150(0.006) 1.100(0.043) MAX 0.076(0.003) 0 to 8° 0.500(0.020) 0.700(0.027) 0.650(0.025) BSC Gauge Plane Dimensions are in milimeters(inches). Top line: (MIN) and Bottom line: (Max) Pin-1 ID Seating Plane 1 16 0.650(0.025) BSC Thermal Characteristics Parameter Symbol Condition Min Typ Max Unit Thermal Resistance Junction to Ambient θ JA Still air - 80 - °C/W θ JA 1m/s air flow - 70 - °C/W θ JA 3m/s air flow - 68 - °C/W Thermal Resistance Junction to Case θ JC Independent of air flow - 36 - °C/W |
类似零件编号 - SL2309 |
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类似说明 - SL2309 |
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