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ADXRS300ABG 数据表(PDF) 8 Page - Analog Devices |
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ADXRS300ABG 数据表(HTML) 8 Page - Analog Devices |
8 / 8 page ADXRS300 OUTLINE DIMENSIONS A B C D E F G BOTTOM VIEW 7 A1 65 4 3 TOP VIEW DETAIL A 3.65 MAX SEATING PLANE DETAIL A BALL DIAMETER 7.00 BSC SQ 4.80 BSC 0.60 0.55 0.50 3.20 2.50 0.44 0.25 0.15 MAX COPLANARITY 0.80 BSC A1 CORNER INDEX AREA 21 Figure 6. 32-Lead Chip Scale Ball Grid Array [CSPBGA] (BC-32) Dimensions shown in millimeters ESD CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Ordering Guide ADXRS300 Products Temperature Package Package Description Package Outline ADXRS300ABG –40°C to +85°C 32-Lead BGA BC-32 ADXRS300ABG-Reel –40°C to +85°C 32-Lead BGA BC-32 © 2003 Analog Devices, Inc. All rights reserved. Trademarks and regis- tered trademarks are the property of their respective companies. C03227-0-3/03(A) Rev. A | Page 8 of 8 |
类似零件编号 - ADXRS300ABG |
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类似说明 - ADXRS300ABG |
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