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BU4030B-E2 数据表(PDF) 7 Page - Rohm |
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BU4030B-E2 数据表(HTML) 7 Page - Rohm |
7 / 16 page Datasheet Datasheet 7/12 BU4030B BU4030BF TSZ02201-0RDR1GZ00040-1-2 © 2013 ROHM Co., Ltd. All rights reserved. 09.Aug.2013 Rev.001 www.rohm.com TSZ22111・15・001 Typical Performance Curves - continued Power Dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance, represented by the symbol θja (°C /W).The temperature of IC inside the package can be estimated by this thermal resistance. Figure 10 shows the model of thermal resistance of the package. Thermal resistance θja, ambient temperature Ta, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below: θja = (Tjmax-Ta) / Pd (°C /W) Derating curve in Figure 11 indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θja. Thermal resistance θja depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. 0 100 200 300 400 500 -50 -25 0 25 50 75 100 Ambient Temperature [°C] VDD=3V VDD=5V VDD=18V VDD=10V Operating Temperature Range Figure 9. “H” to ”L” Propagation Delay Time tPHL Figure 10. Thermal resistance 周囲温度 Ta [℃] チップ 表面温度 Tj [℃] 消費電力 P [W] Ambient temperature Ta (℃) Chip surface temperature Tj (℃) Power dissipation Pd (W) θja=(Tjmax-Ta)/Pd (°C /W) Figure 11. Derating curve 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 25 50 75 100 125 150 Ambient Temperature [ ℃] BU4030B (DIP14) BU4030BF (SOP14) 85 1.18 0.56 |
类似零件编号 - BU4030B-E2 |
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类似说明 - BU4030B-E2 |
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