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ADPD103BCBZRL7 数据表(PDF) 10 Page - Analog Devices |
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ADPD103BCBZRL7 数据表(HTML) 10 Page - Analog Devices |
10 / 53 page Data Sheet ADPD103 Rev. B | Page 9 of 52 ABSOLUTE MAXIMUM RATINGS Table 7. Parameter Rating AVDD to AGND −0.3 V to +2.2 V DVDD to DGND −0.3 V to +2.2 V INT to DGND −0.3 V to +2.2 V PDSO to DGND −0.3 V to +2.2 V LEDXx to LGND −0.3 V to +3.6 V SCL to DGND −0.3 V to +3.9 V SDA to DGND −0.3 V to +3.9 V Junction Temperature 150°C ESD 28-Lead LFCSP Human Body Model (HBM) 1500 V Charge Device Model (CDM) 1250 V Machine Model (MM) 100 V 16-Ball WLCSP Human Body Model (HBM) 1500 V Charge Device Model (CDM) 500 V Machine Model (MM) 100 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE Table 8. Thermal Resistance Package Type θJA Unit 28-Lead LFCSP_WQ 54.9 °C/W 16-Ball WLCSP 60 °C/W RECOMMENDED SOLDERING PROFILE Figure 3 and Table 9 provide details about the recommended soldering profile. tP tL t25°C TO PEAK tS PREHEAT CRITICAL ZONE TL TO TP TIME RAMP-DOWN RAMP-UP TSMIN TSMAX TP TL Figure 3. Recommended Soldering Profile Table 9. Recommended Soldering Profile Profile Feature Condition (Pb-Free) Average Ramp Rate (TL to TP) 3°C/sec max Preheat Minimum Temperature (TSMIN) 150°C Maximum Temperature (TSMAX) 200°C Time (TSMIN to TSMAX) (tS) 60 sec to 180 sec TSMAX to TL Ramp-Up Rate 3°C/sec maximum Time Maintained Above Liquidous Temperature Liquidous Temperature (TL) 217°C Time (tL) 60 sec to 150 sec Peak Temperature (TP) +260 (+0/−5)°C Time Within 5°C of Actual Peak Temperature (tP) <30 sec Ramp-Down Rate 6°C/sec maximum Time from 25°C to Peak Temperature 8 minutes maximum ESD CAUTION |
类似零件编号 - ADPD103BCBZRL7 |
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类似说明 - ADPD103BCBZRL7 |
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