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ADP7157 数据表(PDF) 6 Page - Analog Devices

部件名 ADP7157
功能描述  High PSRR, RF Linear Regulator
Download  23 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADP7157 数据表(HTML) 6 Page - Analog Devices

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Data Sheet
ADP7158
Rev. A | Page 5 of 22
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Rating
VIN to Ground
−0.3 V to +7 V
VREG to Ground
−0.3 V to VIN, or +4 V
(whichever is less)
VOUT to Ground
−0.3 V to VREG, or +4 V
(whichever is less)
VOUT_SENSE to Ground
−0.3 V to VREG, or +4 V
(whichever is less)
VOUT to VOUT_SENSE
±0.3 V
BYP to VOUT
±0.3 V
EN to Ground
−0.3 V to +7 V
BYP to Ground
−0.3 V to VREG, or +4 V
(whichever is less)
REF to Ground
−0.3 V to VREG, or +4 V
(whichever is less)
REF_SENSE to Ground
−0.3 V to +4 V
Storage Temperature Range
−65°C to +150°C
Operational Junction Temperature
Range
−40°C to +125°C
Soldering Conditions
JEDEC J-STD-020
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP7158 can be damaged when the junction
temperature limits are exceeded. Monitoring ambient tempera-
ture does not guarantee that TJ is within the specified temperature
limits. In applications with high power dissipation and poor
thermal resistance, the maximum ambient temperature may
need to be derated.
In applications with moderate power dissipation and low
printed circuit board (PCB) thermal resistance, the maximum
ambient temperature can exceed the maximum limit as long as
the junction temperature is within specification limits. The
junction temperature (TJ) of the device is dependent on the
ambient temperature (TA), the power dissipation of the device
(PD), and the junction to ambient thermal resistance of the
package (θJA).
Calculate the maximum junction temperature (TJ) from the
ambient temperature (TA) and power dissipation (PD) using the
following formula:
TJ = TA + (PD × θJA)
Junction to ambient thermal resistance (θJA) of the package is
based on modeling and calculation using a 4-layer board. The
junction to ambient thermal resistance is highly dependent on
the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θJA may vary, depending
on PCB material, layout, and environmental conditions. The
specified values of θJA are based on a 4-layer, 4 in. × 3 in. circuit
board. See JESD51-7 and JESD51-9 for detailed information on
the board construction.
ΨJB is the junction to board thermal characterization parameter
with units of °C/W. ΨJB of the package is based on modeling and
calculation using a 4-layer board. JESD51-12, Guidelines for
Reporting and Using Electronic Package Thermal Information,
states that thermal characterization parameters are not the same
as thermal resistances. ΨJB measures the component power
flowing through multiple thermal paths rather than a single
path as in thermal resistance, θJB. Therefore, ΨJB thermal paths
include convection from the top of the package as well as
radiation from the package, factors that make ΨJB more useful
in real-world applications. Maximum junction temperature (TJ)
is calculated from the board temperature (TB) and power
dissipation (PD) using the following formula:
TJ = TB + (PD × ΨJB)
See JESD51-8 and JESD51-12 for more detailed information
about ΨJB.
THERMAL RESISTANCE
θJA, θJC, and ΨJB are specified for the worst case conditions, that
is, a device soldered in a circuit board for surface-mount
packages.
Table 5. Thermal Resistance
Package Type
θJA
θJC
ΨJB
Unit
10-Lead LFCSP
53.8
15.6
29.1
°C/W
8-Lead SOIC
50.4
42.3
30.1
°C/W
ESD CAUTION


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