STM809/810/811/812

10/18

MAXIMUM RATING

Stressing the device above the rating listed in the

Absolute Maximum Ratings” table may cause per-

manent damage to the device. These are stress

ratings only and operation of the device at these or

any other conditions above those indicated in the

Operating sections of this specification is not im-

plied. Exposure to Absolute Maximum Rating con-

ditions for extended periods may affect device

reliability. Refer also to the STMicroelectronics

SURE Program and other relevant quality docu-

ments.

Table 3. Absolute Maximum Ratings

Note: 1. Reflow at peak temperature of 255°C to 260°C for < 30 seconds (total thermal budget not to exceed 180°C for between 90 to 150

seconds).

Symbol

Parameter

Value

Unit

–55 to 150

°C

(1)

Lead Solder Temperature for 10 seconds

260

°C

Input or Output Voltage

V

Supply Voltage

–0.3 to 7.0

V

Output Current

20

mA

Power Dissipation

320

mW