SN74LVC1G17

SINGLE SCHMITT TRIGGER BUFFER

SCES351N − JUNE 2001 − REVISED OCTOBER 2005

2

POST OFFICE BOX 655303

ORDERING INFORMATION

TA

PACKAGE†

ORDERABLE PART NUMBER

TOP-SIDE MARKING‡

NanoStar

 − WCSP (DSBGA)

0.17-mm Small Bump − YEA

SN74LVC1G17YEAR

NanoFree

 − WCSP (DSBGA)

0.17-mm Small Bump − YZA (Pb-free)

Reel of 3000

SN74LVC1G17YZAR

_ _ _C7_

NanoStar

 − WCSP (DSBGA)

0.23-mm Large Bump − YEP

Reel of 3000

SN74LVC1G17YEPR

_ _ _C7_

−40

°C to 85°C

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZP (Pb-free)

SN74LVC1G17YZPR

−40

°C to 85°C

NanoFree

 − WCSP (DSBGA)

0.23-mm Large Bump − YZV (Pb-free)

Reel of 3000

SN74LVC1G17YZVR

_ _ _ _

C7

SOT (SOT-23) − DBV

Reel of 3000

SN74LVC1G17DBVR

C17_

SOT (SOT-23) − DBV

Reel of 250

SN74LVC1G17DBVT

C17_

SOT (SC-70) − DCK

Reel of 3000

SN74LVC1G17DCKR

C7_

SOT (SC-70) − DCK

Reel of 250

SN74LVC1G17DCKT

C7_

SOT (SOT-553) − DRL

Reel of 4000

SN74LVC1G17DRLR

C7_

† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

‡ DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.

YEA/YEP, YZA/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2 has two

characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

FUNCTION TABLE

INPUT

A

OUTPUT

Y

H

H

L

L

logic diagram (positive logic)

(DBV, DCK, DRL, YEA, YEP, YZA, and YZP Package)

AY

24

logic diagram (positive logic)

(YZV Package)

AY

13