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TMP320C40GDL40C 数据表(PDF) 5 Page - Texas Instruments |
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TMP320C40GDL40C 数据表(HTML) 5 Page - Texas Instruments |
5 / 15 page TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATINGPOINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024C − MARCH 1997 − REVISED OCTOBER 2001 5 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443 ’320C40 (rev 5.2) known good die pad information 325 244 Die Side Number 4 Pad Number One 1 • • • Die Side Number 1 • • • 81 Zero-Zero (origin) 82 162 Die Side Number 2 243 • • • Die Side Number 3 • • • 163 Die Designator Figure 2. ’320C40 Die Numbering Format (See Table 1) Table 1 provides a reference for the following: D The ’C40 signal identities in relation to the pad numbers D The ’C40 X,Y coordinates, where bond pad 82 serves as the origin (0,0) In addition, the following notes are significant: A. X,Y coordinate data is in microns. B. The active silicon dimensions are 12 424.86 µm × 12035.52 µm (489.16 mils × 473.83 mils). C. The die size is approximately 12 598.40 µm × 12192.00 µm (496.00 mils × 480.00 mils). D. Bond pad dimensions are 108.00 µm × 108.00 µm (4.25 mils × 4.25 mils). E. Center of bond pad to edge of die min (without scribe) = 107.80 µm (4.24 mils). F. For R-Tab devices, gold bump dimensions are approximately 92 µm × 92 µm (3.62 mils × 3.62 mils). G. Coordinate origin is at (0,0) (center of bond pad 82). |
类似零件编号 - TMP320C40GDL40C |
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类似说明 - TMP320C40GDL40C |
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