PACKAGE OPTION ADDENDUM

www.ti.com

17-Dec-2015

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

5962-89757013A

ACTIVE

LCCC

FK

28

1

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

5962-

89757013A

SNJ54AS

885FK

5962-8975701LA

ACTIVE

CDIP

JT

24

1

TBD

A42

N / A for Pkg Type

-55 to 125

5962-8975701LA

SNJ54AS885JT

SN54AS885JT

ACTIVE

CDIP

JT

24

1

TBD

A42

N / A for Pkg Type

-55 to 125

SN54AS885JT

SN74AS885DW

ACTIVE

SOIC

DW

24

25

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

0 to 70

AS885

SN74AS885NT3

OBSOLETE

PDIP

NT

24

TBD

Call TI

Call TI

0 to 70

SNJ54AS885FK

ACTIVE

LCCC

FK

28

1

TBD

POST-PLATE

N / A for Pkg Type

-55 to 125

5962-

89757013A

SNJ54AS

885FK

SNJ54AS885JT

ACTIVE

CDIP

JT

24

1

TBD

A42

N / A for Pkg Type

-55 to 125

5962-8975701LA

SNJ54AS885JT

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)