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MAX232ECPWR 数据表(PDF) 4 Page - Texas Instruments |
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MAX232ECPWR 数据表(HTML) 4 Page - Texas Instruments |
4 / 27 page 4 MAX232E SLLS723C – APRIL 2006 – REVISED AUGUST 2016 www.ti.com Product Folder Links: MAX232E Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network GND. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Input supply voltage (2) –0.3 6 V VS+ Positive output supply voltage VCC – 0.3 15 V VS– Negative output supply voltage –0.3 –15 V VI Input voltage Driver –0.3 VCC + 0.3 V Receiver ±30 VO Output voltage DOUT VS– – 0.3 VS+ + 0.3 V ROUT –0.3 VCC + 0.3 Short-circuit duration DOUT Unlimited TJ Operating virtual junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) Pins 7, 8, 13, and 14 ±15000 V Other pins ±3000 Charged-device model (CDM), per JEDEC specification JESD22-C101(2) All pins ±1500 IEC61000-4-2, air-gap discharge Pins 7, 8, 13, and 14 ±15000 IEC61000-4-2, contact discharge ±8000 6.3 Recommended Operating Conditions MIN NOM MAX UNIT VCC Supply voltage 4.5 5 5.5 V VIH High-level input voltage (DIN1, DIN2) 2 V VIL Low-level input voltage (DIN1, DIN2) 0.8 V Receiver input voltage (RIN1, RIN2) ±3 ±30 V TA Operating free-air temperature MAX232EC 0 70 °C MAX232EI –40 85 (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) Maximum power dissipation is a function of TJ(max), RθJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/RθJA. Operating at the absolute maximum TJ of 150°C can affect reliability. (3) The package thermal impedance is calculated in accordance with JESD 51-7. 6.4 Thermal Information THERMAL METRIC(1)(2)(3) MAX232E UNIT D (SOIC) DW (SOIC) N (PDIP) PW (TSSOP) 16 PINS 16 PINS 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 73.8 73.4 43.3 101.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 33.4 35.1 30 29.3 °C/W RθJB Junction-to-board thermal resistance 31.4 38.3 23.3 47.3 °C/W |
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类似说明 - MAX232ECPWR |
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