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SN74LVC244ADGVR 数据表(PDF) 3 Page - Texas Instruments |
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SN74LVC244ADGVR 数据表(HTML) 3 Page - Texas Instruments |
3 / 34 page Not to scale Thermal Pad 2 1A1 3 2Y4 4 1A2 5 2Y3 6 1A3 7 2Y2 8 1A4 9 2Y1 12 1Y4 13 2A2 14 1Y3 15 2A3 16 1Y2 17 2A4 18 1Y1 19 2OE Not to scale Thermal Pad 1 1A1 2 2Y4 3 1A2 4 2Y3 5 1A3 6 2Y2 11 1Y4 12 2A2 13 1Y3 14 2A3 15 1Y2 16 2A4 1 2 3 4 A B C D E Not to scale 1A1 1OE VCC 2OE 1A2 2A4 2Y4 1Y1 1A3 2Y3 2A3 1Y2 1A4 2A2 2Y2 1Y3 GND 2Y1 2A1 1Y4 Not to scale 1 1OE 20 VCC 2 1A1 19 2OE 3 2Y4 18 1Y1 4 1A2 17 2A4 5 2Y3 16 1Y2 6 1A3 15 2A3 7 2Y2 14 1Y3 8 1A4 13 2A2 9 2Y1 12 1Y4 10 GND 11 2A1 3 SN74LVC244A www.ti.com SCAS414AA – NOVEMBER 1992 – REVISED JUNE 2016 Product Folder Links: SN74LVC244A Submit Documentation Feedback Copyright © 1992–2016, Texas Instruments Incorporated 5 Pin Configuration and Functions ZQN Package 20-Pin BGA Top View DB, DGV, DW, N, NS, and PW Packages 20-Pin SSOP, TVSOP, SOIC, PDIP, SO, and TSSOP Front View RGY Package 20-Pin VQFN Top View RWP Package 20-Pin X1QFN Top View TI recommends to connect the exposed thermal pad to ground for best thermal performance. Must not be connected to any other pin than ground. |
类似零件编号 - SN74LVC244ADGVR |
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类似说明 - SN74LVC244ADGVR |
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