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LM4954 数据表(PDF) 10 Page - Texas Instruments |
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LM4954 数据表(HTML) 10 Page - Texas Instruments |
10 / 23 page LM4954 SNAS292B – JUNE 2005 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Power Dissipation vs Output Power Power Dissipation vs Output Power VDD = 7V, AV = 6dB, VDD = 5V, AV = 6dB, THD+N ≤ 1%, 80kHz BW THD+N ≤ 1%, 80kHz BW Figure 21. Figure 22. Power Dissipation vs Output Power Power Derating – 9 bump DSBGA VDD = 3V, AV = 6dB, PDMAX = 1.26W, VDD = 7V, THD+N ≤ 1%, 80kHz BW RL = 8Ω (1) (2) Figure 23. Figure 24. (1) All bumps have the same thermal resistance and contribute equally when used to lower thermal resistance. The θJA given in the Absolute Maximum Ratings section under Thermal Resistance is for the ITL package without any heat spreading planes on the PCB. (2) The demo board shown has 1.1in2 (710mm2) heat spreading planes on the two internal layers and the bottom layer. The bottom internal layer is electrically VDD while the top internal and bottom layers are electrically GND. Thermal performance for the demo board is found on the Power Derating graph in the Typical Performance Characteristics section. 7V operation requires heat spreading planes for the thermal stability. 10 Submit Documentation Feedback Copyright © 2005–2013, Texas Instruments Incorporated Product Folder Links: LM4954 |
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类似说明 - LM4954 |
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