LM4954

SNAS292B – JUNE 2005 – REVISED APRIL 2013

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Typical Performance Characteristics (continued)

Power Dissipation vs Output Power

Power Dissipation vs Output Power

THD+N

≤ 1%, 80kHz BW

THD+N

≤ 1%, 80kHz BW

Figure 21.

Figure 22.

Power Dissipation vs Output Power

Power Derating – 9 bump DSBGA

THD+N

≤ 1%, 80kHz BW

(1) (2)

Figure 23.

Figure 24.

(1)

All bumps have the same thermal resistance and contribute equally when used to lower thermal resistance. The

Absolute Maximum Ratings section under Thermal Resistance is for the ITL package without any heat spreading planes on the PCB.

(2)

on the Power Derating graph in the Typical Performance Characteristics section. 7V operation requires heat spreading planes for the

thermal stability.

10

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