LM27966 datasheet(3/20 Pages) TI1

部件名	LM27966

功能描述	LM27966 White LED Driver with I2C Compatible Interface

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制造商	TI1 [Texas Instruments]

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LM27966

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SNVS448B – JULY 2006 – REVISED MAY 2013

Absolute Maximum Ratings

(1) (2) (3)

VIN pin voltage

-0.3V to 6.0V

SCL, SDIO, VIO, RESET pin voltages

-0.3V to (VIN+0.3V)w/ 6.0V max

IDx Pin Voltages

-0.3V to (VPOUT+0.3V)w/ 6.0V max

Continuous Power Dissipation

Internally Limited

(4)

Junction Temperature (TJ-MAX)

150ºC

Storage Temperature Range

-65ºC to +150º C

Maximum Lead Temperature (Soldering)

(5)

ESD Rating(6)

Human Body Model

2.0kV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for

availability and specifications.

(4)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 170°C (typ.) and

disengages at TJ = 165°C (typ.).

(5)

For detailed soldering specifications and information, please refer to Application Note 1187: Leadless Leadframe Package (AN-1187).

(6)

The human body model is a 100pF capacitor discharged through 1.5k

Ω resistor into each pin. (MIL-STD-883 3015.7)

Operating Rating

(1) (2)

Input Voltage Range

2.7V to 5.5V

LED Voltage Range

2.0V to 4.0V

Junction Temperature (TJ) Range

-30°C to +100°C

Ambient Temperature (TA) Range

(3)

-30°C to +85°C

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits

and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

100°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

Thermal Properties

Juntion-to-Ambient Thermal

41.3°C/W

Resistance (

θJA), RTW0024A Package

(1)

Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to

Application Note 1187: Leadless Leadframe Package (AN-1187).

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