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LM3243 数据表(PDF) 21 Page - Texas Instruments |
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LM3243 数据表(HTML) 21 Page - Texas Instruments |
21 / 32 page + - LM3243 VBATT_PA VIN DC-DC VBATT + * *Proper decoupling on VBATT_PA is strongly recommended. * Star connection at VBATT VIN + - VBATT_PA LM3243 www.ti.com SNVS782C – OCTOBER 2010 – REVISED AUGUST 2015 Layout Guidelines (continued) fewer bypass capacitors. VBATT Star Connection: It is critically important to use a ‘Star’ connection from VBATT supply to LM3243 PVIN and from VBATT to PA modules as implementing a ‘daisy chain’ supply connection may add noise to the PA output. Figure 26. VBATT Star Connection on VIN And VBATT_PA 10.1.2 Manufacturing Considerations The LM3243 package employs a 16-pin (4 × 4) array of 0.24-mm solder balls, with a 0.4-mm pad pitch. A few simple design rules will go a long way to ensuring a good layout. • Pad size should be 0.225 ± 0.02 mm. Solder mask opening should be 0.325 ± 0.02 mm. • As a thermal relief, connect to each pad with 9 mil wide, 6 mil long traces and incrementally increase each trace to its optimal width. Symmetry is important to ensure the solder bumps re-flow evenly. Refer to TI Application Note AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009). 10.2 Layout Example Figure 27. Simplified LM3243 RF Evaluation Board Schematic Copyright © 2010–2015, Texas Instruments Incorporated Submit Documentation Feedback 21 Product Folder Links: LM3243 |
类似零件编号 - LM3243 |
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类似说明 - LM3243 |
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