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DAC70004IDMDR 数据表(PDF) 4 Page - Texas Instruments

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部件名 DAC70004IDMDR
功能描述  Quad 16-,14-,12-Bit, 1 LSB INL, Buffered, Voltage-Output Digital-to-Analog Converters
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

DAC70004IDMDR 数据表(HTML) 4 Page - Texas Instruments

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4
DAC80004, DAC70004, DAC60004
SLASED6B – APRIL 2016 – REVISED JUNE 2016
www.ti.com
Product Folder Links: DAC80004 DAC70004 DAC60004
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
Voltage, VDD to GND
–0.3
7
V
Voltage, digital input or output to GND
–0.3
VDD + 0.3
V
Voltage, analog input (REFIN) or output (VOUTx) to GND
–0.3
VDD + 0.3
V
Input current to any pin except supply pins
–10
10
mA
Maximum junction temperature
150
°C
Storage temperature range, Tstg
-60
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
±2000
V
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins(2)
±1000
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
Voltage, VDD to GND
2.7
5.5
V
Voltage, analog input (REFIN) or output
(VOUTx) to GND
2.7 V
≤ VDD ≤ 4.5 V
2.2
VDD – 0.2
V
4.5 V
≤ VDD ≤ 5.5 V
2.2
VDD
V
Ambient Operating Temperature, TA
-40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.4 Thermal Information
THERMAL METRIC(1)
DACx0004
UNIT
DMD (VSON)
PW (TSSOP)
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
39.6
99.1
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
27.3
23.4
°C/W
RθJB
Junction-to-board thermal resistance
9.0
42.8
°C/W
ψJT
Junction-to-top characterization parameter
0.3
0.9
°C/W
ψJB
Junction-to-board characterization parameter
8.9
42.0
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
6.5
N/A
°C/W


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