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DAC8814ICDBT Datasheet(数据表) 2 Page - Texas Instruments

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部件型号  DAC8814ICDBT
说明  Quad, Serial Input 16-Bit Multiplying Digital-to-Analog Converter
下载  27 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 

 
 2 page
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www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)
DAC8814
SBAS338D – JANUARY 2005 – REVISED SEPTEMBER 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION(1)
MINIMUM
RELATIVE
DIFFERENTIAL
SPECIFIED
TRANSPORT
ACCURACY
NONLINEARITY
TEMPERATURE
PACKAGE-
PACKAGE
ORDERING
MEDIA,
PRODUCT
(LSB)
(LSB)
RANGE
LEAD
DESIGNATOR
NUMBER
QUANTITY
DAC8814ICDBT
Tape and Reel, 250
DAC8814C
±1
±1
– 40
°C to +85°C
SSOP-28
DB
DAC8814ICDBR
Tape and Reel, 2500
DAC8814IBDBT
Tape and Reel, 250
DAC8814B
±4
±1.5
–40
°C to +85°C
SSOP-28
DB
DAC8814IBDBR
Tape and Reel, 2500
(1)
For the most current specifications and package information, see the Package Option Addendum located at the end of this document, or
see the TI website at www.ti.com.
DAC8814
UNIT
VDD to GND
–0.3 to +8
V
VREF to GND
–18 to +18
V
Logic inputs and output to GND
–0.3 to +8
V
V(IOUT) to GND
–0.3 to VDD + 0.3
V
AGNDX to DGND
–0.3 to +0.3
V
Input current to any pin except supplies
±50
mA
Package power dissipation
(TJmax – TA)/θJA
W
Thermal resistance,
θ
JA
28-Lead shrink surface-mount (RS-28)
100
°C/W
Maximum junction temperature (TJmax)
150
°C
Operating temperature range, Model A
–40 to +85
°C
Storage temperature range
–65 to +150
°C
ESD rating, HBM
3000
V
ESD rating, CDM
500
V
(1)
Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability.
2
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