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ADG820BRM 数据表(PDF) 1 Page - Analog Devices |
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ADG820BRM 数据表(HTML) 1 Page - Analog Devices |
1 / 12 page REV. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. a ADG819/ADG820 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2002 0.5 CMOS 1.8 V to 5.5 V 2:1 Mux/SPDT Switches FUNCTIONAL BLOCK DIAGRAM ADG819/ ADG820 IN S1 S2 D SWITCHES SHOWN FOR A LOGIC “1” INPUT FEATURES Low On Resistance 0.8 Max at 125 C 0.25 Max On Resistance Flatness 1.8 V to 5.5 V Single Supply 200 mA Current Carrying Capability Automotive Temperature Range: –40 C to +125 C Rail-to-Rail Operation 6-Lead SOT-23 Package, 8-Lead SOIC Package, and 6-Bump MicroCSP (Micro Chip Scale Package) ADG819 Fast Switching Times Typical Power Consumption (<0.01 W) TTL-/CMOS-Compatible Inputs Pin Compatible with the ADG719 (ADG819) APPLICATIONS Power Routing Battery-Powered Systems Communication Systems Data Acquisition Systems Cellular Phones Modems PCMCIA Cards Hard Drives Relay Replacement GENERAL DESCRIPTION The ADG819 and the ADG820 are monolithic, CMOS, SPDT (single-pole, double-throw) switches. These switches are designed on a submicron process that provides low power dissipation yet gives high switching speed, low On resistance, and low leakage currents. Low power consumption and an operating supply range of 1.8 V to 5.5 V make the ADG819 and ADG820 ideal for battery-pow- ered, portable instruments. Each switch of the ADG819 and the ADG820 conducts equally well in both directions when on. The ADG819 exhibits break- before-make switching action, thus preventing momentary shorting when switching channels. The ADG820 exhibits make-before- break action. The ADG819 and the ADG820 are available in a 6-lead SOT-23 package and an 8-lead µSOIC package. The ADG819 is also available in a 2 × 3 bump 1.14 mm × 2.18 mm MicroCSP package. This chip occupies only a 1.14 mm × 2.18 mm area, making it the ideal candidate for space-constrained applications. PRODUCT HIGHLIGHTS 1. Very low ON resistance, 0.5 Ω typical 2. 1.8 V to 5.5 V single-supply operation 3. High current carrying capability 4. Tiny 6-lead SOT-23 package, 8-lead µSOIC package, and 2 × 3 bump 1.14 mm × 2.18 mm MicroCSP package (ADG819 only) |
类似零件编号 - ADG820BRM |
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类似说明 - ADG820BRM |
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