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ADG819BCB 数据表(PDF) 4 Page - Analog Devices |
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ADG819BCB 数据表(HTML) 4 Page - Analog Devices |
4 / 12 page REV. 0 ADG819/ADG820 –4– ABSOLUTE MAXIMUM RATINGS 1 (TA = 25 °C, unless otherwise noted.) VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V Analog Inputs 2 . . . . . . . . . . . . . . . . . –0.3 V to V DD + 0.3 V or . . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First Digital Inputs 2 . . . . . . . . . . . . . . . . . –0.3 V to V DD + 0.3 V or . . . . . . . . . . . . . . . . . . . . . . . 30 mA, Whichever Occurs First Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA . . . . . . . . . . . . . . . .(Pulsed at 1 ms, 10% Duty Cycle Max) Continuous Current, S or D . . . . . . . . . . . . . . . . . . . 200 mA Operating Temperature Range Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . –40 °C to +85°C Automotive . . . . . . . . . . . . . . . . . . . . . . . . –40 °C to +125°C Storage Temperature Range . . . . . . . . . . . . –65 °C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150 °C µSOIC Package JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 206 °C/W JC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 44 °C/W SOT-23 Package (4-Layer Board) JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 119 °C/W MicroCSP Package JA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . . . TBD Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300 °C IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . 235 °C NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause perma- nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. Table I. Truth Table for the ADG819/ADG820 IN Switch S1 Switch S2 0 ON OFF 1 OFF ON PIN CONFIGURATIONS 6-Lead SOT-23 (RT-6) TOP VIEW (Not to Scale) 6 5 4 1 2 3 IN S2 ADG819/ ADG820 VDD GND D S1 8-Lead µSOIC (RM-8) TOP VIEW (Not to Scale) 8 7 6 5 1 2 3 4 NC = NO CONNECT D S2 ADG819/ ADG820 S1 VDD GND NC IN NC 2 3 MicroCSP S2 IN S1 VDD D GND ADG819 ONLY TOP VIEW (BUMPS AT THE BOTTOM) NOT TO SCALE 1 2 3 6 5 4 ORDERING GUIDE Model Option Temperature Range Brand 1 Package Description Package ADG819BRM –40 °C to +125°C SNB µSOIC (MicroSmall Outline IC) RM-8 ADG819BRT –40 °C to +125°C SNB SOT-23 (Plastic Surface-Mount) RT-6 2 ADG819BCB –40 °C to +85°C SNB MicroCSP (Micro Chip Scale Package) CB-62 ADG820BRM –40 °C to +125°C SPB µSOIC (MicroSmall Outline IC) RM-8 ADG820BRT –40 °C to +125°C SPB SOT-23 (Plastic Surface-Mount) RT-6 2 NOTES 1Branding on these packages is limited to three characters due to space constraints. 2Contact factory for availability. |
类似零件编号 - ADG819BCB |
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类似说明 - ADG819BCB |
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