SN74CBTU4411ZSTR datasheet(6/21 Pages) TI1

部件名	SN74CBTU4411ZSTR

功能描述	Multiplexer/Demultiplexer

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制造商	TI1 [Texas Instruments]

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6

SN74CBTU4411

SCDS192A – APRIL 2005 – REVISED FEBRUARY 2016

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground unless otherwise specified.

(3)

The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(4)

VI and VO are used to denote specific conditions for VI/O.

(5)

II and IO are used to denote specific conditions for II/O.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDD

Supply voltage

–0.5

2.5

V

VIN

Control input voltage(2)(3)

–0.5

2.5

V

VI/O

Switch I/O voltage(2)(3)(4)

–0.5

2.5

V

IIK

Control input clamp current

VIN < 0 or VIN > 0

±50

mA

II/OK

I/O port clamp current

VI/O < 0 or VI/O > 0

±50

mA

II/O

ON-state switch current(5)

±100

mA

Continuous current through VDD or GND pins

±100

mA

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2500

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±750

(1)

All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. See the TI application report,

Implications of Slow or Floating CMOS Inputs (SCBA004).

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

NOM

MAX

UNIT

VDD

Supply voltage

1.7

1.8

1.9

V

VREF

Reference supply voltage

0.49 × VDD

0.5 × VDD

0.51 × VDD

V

VBIAS

BIAS supply voltage

0

0.3 × VDD

0.33 × VDD

V

VIH

High-level control input voltage

S

VREF + 250 mV

V

EN, TX, DQS_EN

0.65 × VDD

VIL

Low-level control input voltage

S

VREF – 250 mV

V

EN, TX, DQS_EN

0.35 × VDD

VI/O

Data input/output voltage

0

VDD

V

TA

Operating free-air temperature

0

85

°C

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