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SN74CBTU4411ZSTR 数据表(PDF) 6 Page - Texas Instruments |
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SN74CBTU4411ZSTR 数据表(HTML) 6 Page - Texas Instruments |
6 / 21 page 6 SN74CBTU4411 SCDS192A – APRIL 2005 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: SN74CBTU4411 Submit Documentation Feedback Copyright © 2005–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to ground unless otherwise specified. (3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (4) VI and VO are used to denote specific conditions for VI/O. (5) II and IO are used to denote specific conditions for II/O. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD Supply voltage –0.5 2.5 V VIN Control input voltage(2)(3) –0.5 2.5 V VI/O Switch I/O voltage(2)(3)(4) –0.5 2.5 V IIK Control input clamp current VIN < 0 or VIN > 0 ±50 mA II/OK I/O port clamp current VI/O < 0 or VI/O > 0 ±50 mA II/O ON-state switch current(5) ±100 mA Continuous current through VDD or GND pins ±100 mA TJ Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750 (1) All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN NOM MAX UNIT VDD Supply voltage 1.7 1.8 1.9 V VREF Reference supply voltage 0.49 × VDD 0.5 × VDD 0.51 × VDD V VBIAS BIAS supply voltage 0 0.3 × VDD 0.33 × VDD V VIH High-level control input voltage S VREF + 250 mV V EN, TX, DQS_EN 0.65 × VDD VIL Low-level control input voltage S VREF – 250 mV V EN, TX, DQS_EN 0.35 × VDD VI/O Data input/output voltage 0 VDD V TA Operating free-air temperature 0 85 °C |
类似零件编号 - SN74CBTU4411ZSTR |
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类似说明 - SN74CBTU4411ZSTR |
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