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ADC10061 数据表(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
部件名 ADC10061
功能描述  10-Bit 600 ns A/D Converter with Input Multiplexer and Sample/Hold
Download  14 Pages
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制造商  NSC [National Semiconductor (TI)]
网页  http://www.national.com
标志 NSC - National Semiconductor (TI)

ADC10061 数据表(HTML) 5 Page - National Semiconductor (TI)

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DC Electrical Characteristics (Continued)
The following specifications apply for V
+ = +5V, V
REF(+) = 5V VREF(−) = GND, and Speed Adjust pin unconnected unless other-
wise specified. Boldface limits apply for T
A = TJ = TMIN to TMAX; all other limits TA = TJ = +25˚C.
Symbol
Parameter
Conditions
Typical
(Note 7)
Limit
(Note 8)
Units
(Limit)
V
OUT(0)
Logical “0” Output Voltage
V
+ = 4.5V, I
OUT = 1.6 mA
0.4
V (max)
I
OUT
TRI-STATE® Output Current
V
OUT = 5V
V
OUT = 0V
0.1
−0.1
50
−50
µA (max)
µA (max)
DI
CC
DV
CC Supply Current
CS = S/H = RD = 0, R
SA =
CS = S/H = RD = 0, R
SA = 18 kΩ
1.0
1.0
2
mA (max)
mA (max)
AI
CC
AV
CC Supply Current
CS = S/H = RD = 0, R
SA =
CS = S/H = RD = 0, R
SA = 18 kΩ
30
30
45
mA (max)
mA (max)
AC Electrical Characteristics
The following specifications apply for V
+ = +5V, t
r = tf = 20 ns, VREF(+) = 5V, VREF(−) = GND, and Speed Adjust pin uncon-
nected unless otherwise specified. Boldface limits apply for T
A = TJ = TMIN to TMAX; all other limits TA = TJ = +25˚C.
Symbol
Parameter
Conditions
Typical
(Note 7)
Limit
(Note 8)
Units
(Limit)
t
CONV
Mode 1 Conversion Time from
Rising Edge of S/H to Falling Edge
of INT
R
SA =
R
SA = 18k
600
375
750/900
ns(max)
ns
t
CRD
Mode 2 Conversion Time
R
SA =
Mode 2, R
SA = 18k
850
530
1400
ns(max)
ns
t
ACC1
Access Time (Delay from Falling
Edge of RD to Output Valid)
Mode 1; C
L = 100 pF
30
60
ns (max)
t
ACC2
Access Time (Delay from Falling
Edge of RD to Output Valid)
Mode 2; C
L = 100 pF
900
t
CRD +50
ns (max)
t
SH
Minimum Sample Time
(
Figure 1); (Note 8)
250
ns (max)
t
1H,t0H
TRI-STATE Control (Delay from
Rising Edge of RD to High-Z State)
R
L = 1k, CL = 10 pF
30
60
ns (max)
t
INTH
Delay from Rising Edge of RD to
Rising Edge of INT
C
L = 100 pF
25
50
ns (max)
t
P
Delay from End of Conversion to
Next Conversion
50
ns (max)
t
MS
Multiplexer Control Setup Time
10
75
ns (max)
t
MH
Multiplexer Hold Time
10
40
ns (max)
C
VIN
Analog Input Capacitance
35
pF (max)
C
OUT
Logic Output Capacitance
5
pF (max)
C
IN
Logic Input Capacitance
5
pF (max)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is func-
tional. These ratings do not guarantee specific performance limits, however. For guaranteed specifications and test conditions, see the Electrical Characteristics. The
guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed
test conditons.
Note 2: All voltages are measured with respect to GND, unless otherwise specified.
Note 3: When the input voltage (VIN) at any pin exceeds the power supply rails (VIN < GND or VIN > V
+) the absolute value of current at that pin should be limited
to 5 mA or less. The 20 mA package input current limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA and the ambient temperature, TA. The maximum
allowable power dissipation at any temperature is PD = (TJMAX −TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. In most cases,
the maximum derated power dissipation will be reached only during fault conditions. For these devices, TJMAX for a board-mounted device can be found from the
tables below:
Device
θ
JA (˚C/W)
ADC10061CIWM
54
ADC10062CIWM
48
ADC10064CIWM
44
Note 5: Human body model, 100 pF discharged through a 1.5 k
Ω resistor.
Note 6: See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” or the section titled “Surface Mount” found in a current National Semicon-
ductor Linear Data Book for other methods of soldering surface mount devices.
Note 7: Typicals are at +25˚C and represent must likely parametric norm.
www.national.com
5


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