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TLP2466 数据表(PDF) 2 Page - Toshiba Semiconductor |
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TLP2466 数据表(HTML) 2 Page - Toshiba Semiconductor |
2 / 11 page TLP2466 2 4. 4. 4. 4. Packaging and Pin Configuration Packaging and Pin Configuration Packaging and Pin Configuration Packaging and Pin Configuration 11-5K1S 1: N.C. 2: Anode 3: Cathode 4: N.C. 5: GND 6: VO(Output) 7: N.C. 8: VCC 5. 5. 5. 5. Internal Circuit (Note) Internal Circuit (Note) Internal Circuit (Note) Internal Circuit (Note) Note: A 0.1µF bypass capacitor must be connected between pin 8 and pin 5. 6. 6. 6. 6. Principle of Operation Principle of Operation Principle of Operation Principle of Operation 6.1. 6.1. 6.1. 6.1. Truth Table Truth Table Truth Table Truth Table Input H L LED ON OFF M1 OFF ON M2 ON OFF Output L H 6.2. 6.2. 6.2. 6.2. Mechanical Parameters Mechanical Parameters Mechanical Parameters Mechanical Parameters Characteristics Creepage distances Clearance distances Internal isolation thickness Min 4.2 4.2 Unit mm 2016-02-10 Rev.2.0 ©2016 Toshiba Corporation |
类似零件编号 - TLP2466 |
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类似说明 - TLP2466 |
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