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TS31023 数据表(PDF) 11 Page - Semtech Corporation |
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TS31023 数据表(HTML) 11 Page - Semtech Corporation |
11 / 15 page TS31023/223 Final Datasheet Rev 1.1 March 19, 2015 www.semtech.com 11 of 15 Semtech Proprietary & Confidential Package Thickness Volume mm3 < 350 Volume mm3 > 350 < 2.5mm 240 +0/-5 OC 225 +0/-5 OC > 2.5mm 225 +0/-5 OC 225 +0/-5 OC Package Thickness Volume mm3 < 350 Volume mm3 350 - 2000 Volume mm3 > 2000 < 1.6mm 260 OC* 260 OC* 260 OC* 1.6mm - 2.5mm 260 OC* 250 OC* 245 OC* > 2.5mm 250 OC* 245 OC* 245 OC* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classified temperature at the rated MSL level Note 1: Package volume excludes external terminals (balls, bumps, lands, leads) and/or non-integral heat sinks. Note 2: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes reduc- es the thermal gradients between packages. However, thermal gradients due to differences in thermal mas of SMD packages may still exist. Note 3: Components intended for use in a “lead-free” assembly process shall be evaluated using the “lead-free” peak temperature and profiles defined in Tables 4-1, 4.2 and 5-2 whether or not lead free. Table 4-1 SnPb Eutectic Process - Package Peak Reflow Temperatures Table 4-2 Pb-free Process - Package Peak Reflow Temperatures |
类似零件编号 - TS31023 |
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类似说明 - TS31023 |
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