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TPIC2050RDFDRG4 数据表(PDF) 5 Page - Texas Instruments |
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TPIC2050RDFDRG4 数据表(HTML) 5 Page - Texas Instruments |
5 / 68 page TPIC2050 www.ti.com SLIS167 – AUGUST 2015 Pin Functions (continued) PIN I/O DESCRIPTION NAME NO. P12V_2 46 PS Power-supply terminal for 12-V driver output stage W 47 OUT W-phase output terminal for spindle motor ICOM2 48 MISC Current sense resistor terminal for spindle driver MCOM 49 IN Motor center tap connection ISENSE 50 IN Current sense input terminal for spindle drivers AGND 51 PS Ground terminal for internal analog STP1_P 52 OUT STP1 positive output terminal for collimator STP1_N 53 OUT STP1 negative output terminal for collimator STP2_P 54 OUT STP2 positive output terminal for collimator STP2_N 55 OUT STP2 negative output terminal for collimator P5V_2 56 PS Power supply terminal for 5-V driver output 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT 5-V supply voltage P5V 6 12-V supply voltage P12V 15 9.5-V supply voltage A9P5V 15 V Load supply P5V12 voltage 15 Spindle output peak voltage 15 Spindle output current 2.5 Spindle output peak current, (PW ≤ 2 ms, Duty ≤ 30%) 3.5 Sled output peak current 1.0 A Focus/tracking/tilt driver output peak current 1.0 Load driver output peak current 1.0 Laser diode driver output peak current 247(2) mA Input/output voltage –0.3 VCC + 0.3 V Power dissipation(3) 1344 mW Operating temperature –20 75 Lead temperature 1.6 mm from case for 10 s 260 °C Tstg Storage temperature –60 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The LDD output time of the maximum current should maintain 25% or less of the xsleep total ON time. (3) A lower RθJC is attainable if the exposed pad is connected to a large copper ground plane. RθJC and RθJA are values for 56-pin TSSOP without a exposed heat slug (HSL) on bottom. Actual thermal resistance would be better than the above values. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: TPIC2050 |
类似零件编号 - TPIC2050RDFDRG4 |
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类似说明 - TPIC2050RDFDRG4 |
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