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STPTIC-68G1C5 数据表(PDF) 5 Page - STMicroelectronics |
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STPTIC-68G1C5 数据表(HTML) 5 Page - STMicroelectronics |
5 / 10 page DocID028611 Rev 1 5/10 STPTIC-27L2 Package information 10 2 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 Flip-Chip package information Figure 7. Flip-Chip package outline The land pattern below is recommended for soldering the STPTIC-G2 on PCB. NC stands for No Connect, this pad must not be connected on application board. Please leave this pad floating. Table 4. Flip-Chip package dimensions Dimensions (in microns) A1 A2 B1 B2 B4 C1 C2 D1 D2 D3 E1 E2 STPTIC-27L2 1000 750 140 500 360 105 540 225 90 315 125 165 Tolerance ±30 ±30 ±15 ±10 ±15 ±15 ±10 ±20 ±20 ±40 ±20 ±20 |
类似零件编号 - STPTIC-68G1C5 |
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类似说明 - STPTIC-68G1C5 |
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