6

TPD4S014

SLVSAU0G – MAY 2011 – REVISED DECEMBER 2015

www.ti.com

Product Folder Links: TPD4S014

Submit Documentation Feedback

Copyright © 2011–2015, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

TPD4S014

UNIT

DSQ (WSON)

8 PINS

Junction-to-ambient thermal resistance

70.3

°C/W

Junction-to-case (top) thermal resistance

46.3

°C/W

Junction-to-board thermal resistance

33.8

°C/W

Junction-to-top characterization parameter

2.9

°C/W

Junction-to-board characterization parameter

33.5

°C/W

Junction-to-case (bottom) thermal resistance

16.3

°C/W

6.5 Electrical Characteristics, EN, ACK, D+, D–, ID Pins

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

High-level input voltage EN

Load current = 50 µA

1

V

Low-level input voltage EN

Load current = 50 µA

0.5

V

Input Leakage Current EN, D+, D–, ID

1

µA

Low-level output voltage ACK

0.1

V

Diode forward Voltage D+, D–, ID pins; lower clamp diode

0.95

V

Differential Capacitance between the D+, D– lines

0.03

pF

Capacitance to GND for the D+, D– lines

ƒ = 1 MHz

1.6

pF

Capacitance to GND for the ID line

19

pF

Reverse stand-off voltage of D+, D- and ID pins

5

V

Breakdown voltage D+, D–, ID pins

6

V

28

V

Dynamic on resistance D+, D–, ID clamps

1

Ω