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LM319 Datasheet(数据表) 4 Page - Texas Instruments

部件型号  LM319
说明  High Speed Dual Comparator
下载  21 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 

 
 4 page
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4
LM119, LM219, LM319
SNOSBJ2B – AUGUST 2000 – REVISED JANUARY 2016
www.ti.com
Product Folder Links: LM119 LM219 LM319
Submit Documentation Feedback
Copyright © 2000–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
Refer to RETS119X for LM119H/883 and LM119J/883 specifications.
(4)
For supply voltages less than ±15 V the absolute maximum input voltage is equal to the supply voltage.
(5)
The maximum junction temperature of the LM119 is 150°C, while that of the LM219 is 110°C. For operating at elevated temperatures,
devices in the H10 package must be derated based on a thermal resistance of 160°C/W, junction to ambient, or 19°C/W, junction to
case. The thermal resistance of the J14 and N14 packages is 100°C/W, junction to ambient.
(6)
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2) (3)
MIN
MAX
UNIT
Total supply voltage
36
V
Output to negative supply voltage
36
V
Ground to negative supply voltage
25
V
Ground to positive supply voltage
18
V
Differential input voltage
–5
+5
V
Input voltage(4)
–15
+15
V
Power dissipation(5)
500
mW
Output short circuit duration
10
sec
Lead temperature (soldering, 10 sec.)
260
°C
Soldering information(6)
Dual-In-Line Package Soldering (10 seconds)
260
°C
Small Outline Package Vapor Phase (60
seconds)
215
Small Outline Package Infrared (15 seconds)
220
Operating temperature
LM119
–55
125
°C
LM219
–25
85
LM319A, LM319
0
70
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
5.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±800
V
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
5.3 Thermal Information
THERMAL METRIC(1)
LM119, LM219, LM319
UNIT
TO-100
(LME)
PDIP
(NFF)
CDIP
(J)
10 PINS
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
160
100
100
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
19
NA
NA
°C/W




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