NC

VCC+

IN1

í

IN1+

VCC

í

NC

OUT

NC

RG

RIN

RF

GND

VIN

VS-

GND

VS+

GND

Run the input traces as far

away from the supply lines

as possible

Only needed for

dual-supply

operation

Place components close to

device and to each other to

reduce parasitic errors

Use low-ESR, ceramic

bypass capacitor

(or GND for single supply)

Ground (GND) plane on another layer

VOUT

+

RIN

RG

RF

VOUT

VIN

TS321

www.ti.com

SLOS489C – DECEMBER 2005 – REVISED APRIL 2015

Layout Guidelines (continued)

opposed to in parallel with the noisy trace.

•

Place the external components as close to the device as possible. Keeping RF and RG close to the inverting

input minimizes parasitic capacitance, as shown in Layout Example.

•

Keep the length of input traces as short as possible. Always remember that the input traces are the most

sensitive part of the circuit.

•

Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce

leakage currents from nearby traces that are at different potentials.

11.2 Layout Example

Figure 10. Operational Amplifier Schematic for Noninverting Configuration

Figure 11. Operational Amplifier Board Layout for Noninverting Configuration

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