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SMBG5338B 数据表(PDF) 1 Page - Microsemi Corporation |
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SMBG5338B 数据表(HTML) 1 Page - Microsemi Corporation |
1 / 3 page 8700 E. Thomas Road Scottsdale, AZ 85252 Tel: (480) 941-6300 Fax: (480) 947-1503 SMBG5333B thru SMBG5388B and SMBJ5333B thru SMBJ5388B Features • Low profile package for surface mounting (flat handling surface for accurate placement) • Zener Voltage 3.3V to 200V • High Surge Current Capability • For available tolerances – see note 1 • Available on Tape and Reel (see EIA std RS-481) Mechanical Data • Standard JEDEC outlines as shown • Terminals gull-wing or c-bend (modified J-bend) tin-lead plated and solderable per MIL-STD-750, method 2026 • Polarity is indicated by cathode band • Maximum temperature for soldering: 260 o C for 10 seconds. Maximum Ratings @ 25 oC Unless Otherwise Specified Forward Voltage at 1.0A Current VF 1.2 Volts Steady State Power Dissipation P(AV) 5 Watts See note 2 Operating and Storage Temperatures TJ, TSTG -65 oC to + 150 oC Thermal Resistance RθJL 25 oC/W 5 Watt Surface Mount Silicon Zener Diodes Notes 1. Mounted on copper pads as shown below. 2. Lead temperature at 25 oC = T L at mounting plane. Derate linearly above 25 oC to zero power at 150 oC Datasheet# MSC0302A Date: 06/26/97 Gull Wing 0.150 Modified J-Bend 0.089 0.085 Pad Layout |
类似零件编号 - SMBG5338B |
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类似说明 - SMBG5338B |
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