MIL-PRF-19500/116L

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2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited

herein the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws

and regulations unless a specific exemption has been obtained.

3. REQUIREMENTS

3.1 General. The requirements for acquiring the product described herein shall consist of this document and

MIL-PRF-19500.

3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a

manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)

before contract award (see 4.2 and 6.3).

3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as

specified in MIL-PRF-19500 and as follows.

V

fr

Forward recovery voltage. Specified maximum forward voltage used to determine forward recovery

time.

LS

Lead spacing distance between device body and electrical/mechanical contact on lead.

UB

Hermetic unleaded 3 terminal (LCC, Leadless Chip Carrier) package type.

UR

Unleaded round package type designation.

3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in

MIL-PRF-19500, and on figures 1, 2, 3, 4, and 5 herein.

3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.

Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).

3.4.2 Diode construction. All devices (except UB version) shall be metallurgically bonded double plug construction

in accordance with the requirements of category I, II, or III (see MIL-PRF-19500). The UB package shall be wire

bonded, eutectically mounted devices.

3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance

characteristics are as specified in 1.3, 1.4, and table I.

3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in 4.4.2 and

4.4.3 herein.

3.7 Marking. Marking shall be in accordance with MIL-PRF-19500. At the option of the manufacturer, marking

may be omitted from the body, but shall be retained on the initial container.

3.7.1 UR devices. "UR" devices shall be marked with a cathode band only. Initial container package marking shall

be in accordance with MIL-PRF-19500.

3.7.2 UB devices. The part number may be reduced to J4148, JX4148, or JV4148. Manufacturers identification

and date code shall be marked on the devices.

3.7.3 UBR devices. The part number may be reduced to J4148, JX4148, or JV4148. Manufacturers identification

and date code shall be marked on the devices.

3.8 Polarity. The polarity shall be indicated with a contrasting color band to denote the cathode end. No color

coding will be permitted. UB packages do not require polarity marking.

3.9 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and

shall be free from other defects that will affect life, serviceability, or appearance.