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LM25085-Q1 数据表(PDF) 4 Page - Texas Instruments

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部件名 LM25085-Q1
功能描述  LM25085 / -Q1 42V Constant On-Time PFET Buck Switching Controller
Download  34 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

LM25085-Q1 数据表(HTML) 4 Page - Texas Instruments

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LM25085, LM25085-Q1
SNVS593J – OCTOBER 2008 – REVISED NOVEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
See (1) (2)
MIN
MAX
UNIT
VIN to GND
-0.3
45
V
ISEN to GND
-3
VIN + 0.3
V
ADJ to GND
-0.3
VIN + 0.3
V
RT, FB to GND
-0.3
7
V
VIN to VCC, VIN to PGATE
-0.3
10
V
(1)
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
6.2 Handling Ratings - LM25085
MIN
MAX
UNIT
Tstg
Storage temperature range
-65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
2
kV
pins(1)
V(ESD)
Electrostatic discharge
Charged device model (CDM), per JEDEC specification
750
V
JESD22-C101, all pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Handling Ratings - LM25085-Q1
MIN
MAX
UNIT
Tstg
Storage temperature range
-65
150
°C
Human body model (HBM), per AEC Q100-002(1)
2
kV
V(ESD)
Electrostatic discharge
Corner pins 1, 4, 5, 8
750
Charged device model (CDM), per
V
AEC Q100-011
Other pins
750
(1)
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.4 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VIN Voltage
4.5
42
V
Junction Temperature
−40
125
°C
6.5 Thermal Information
LM25085
LM25085 /
LM25085
Q-1
THERMAL METRIC(1)
VSSOP
HVSSOP-
WSON
UNIT
PowerPAD
8 PINS
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance
153
54.1
44.8
RθJC
Junction-to-case (top) thermal resistance
52.5
49.1
39.4
RθJB
Junction-to-board thermal resistance
71.9
26.7
11.6
°C/W
ψJT
Junction-to-top characterization parameter
4.6
1.3
0.3
ψJB
Junction-to-board characterization parameter
70.8
26.5
11.6
RθJC(bot)
Junction-to-case (bottom) thermal resistance
29
3.6
5.0
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 2008–2014, Texas Instruments Incorporated
Product Folder Links: LM25085 LM25085-Q1


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