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DAC3152 数据表(PDF) 4 Page - Texas Instruments

部件名 DAC3152
功能描述  Dual-Channel, 10-/12-Bit, 500-MSPS Digital-to-Analog Converters (DACs)
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

DAC3152 数据表(HTML) 4 Page - Texas Instruments

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DAC3152
DAC3162
SLAS736D – NOVEMBER 2010 – REVISED AUGUST 2012
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
MIN
MAX
DVDD18, CLKVDD18
–0.5
2.3
V
Supply-voltage range(2)
VFUSE
–0.5
2.3
V
AVDD33
–0.5
4
V
D[11..0]P/N
–0.5
DVDD18 + 0.5
V
DACCLKP/N
–0.5
CLKVDD18 + 0.5 V
V
Pin-voltage range(2)
BIASJ, SLEEPB
–0.5
AVDD33 + 0.7 V
V
IOUTAP/N, IOUTBP/N
–1
AVDD33 + 0.7 V
V
Peak input current (any input)
±20
mA
Peak total input current (all inputs)
±30
mA
Operating free-air temperature range, TA
–40
85
°C
Storage temperature range, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of these or any other conditions beyond those indicated under Recommended Operating Conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
Measured with respect to GND
THERMAL INFORMATION
DAC3152
DAC3162
THERMAL METRIC(1)(2)
UNIT
RGZ (48 PINS)
θJA
Junction-to-ambient thermal resistance
28.9
θJCtop
Junction-to-case (top) thermal resistance
14.9
θJB
Junction-to-board thermal resistance
5.62
°C/W
ψJT
Junction-to-top characterization parameter
0.3
ψJB
Junction-to-board characterization parameter
5.6
θJCbot
Junction-to-case (bottom) thermal resistance
1.7
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
4
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Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links: DAC3152 DAC3162


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