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SM6002 数据表(PDF) 3 Page - Solid State Optronic |
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SM6002 数据表(HTML) 3 Page - Solid State Optronic |
3 / 7 page © 2013 Solid State Optronics • San José, CA www.ssousa.com • +1.408.293.4600 Page 3 of 7 SM6002 /H/S/TR Rev 2.00 (11/12/2013) 001712 SM6002 Optically Coupled MOSFET Driver w/Discharge Circuit Process Step Description Parameter A Preheat Start Temperature (ºC) 150ºC B Preheat Finish Temperature (ºC) 180ºC C Preheat Time (s) 90 - 120s D Melting Temperature (ºC) 230ºC E Time above Melting Temperature (s) 30s F Peak Temperature, at Terminal (ºC) 260ºC G Dwell Time at Peak Temperature (s) 10s H Cool-down (ºC/s) <6ºC/s SM6002 Solder Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device package should not exceed 250ºC: A B C D F E G H (2) Wave Solder: (3) Hand Solder: Maximum Temperature: 260ºC (at terminal) Maximum Time: 10s Pre-heating: 100 - 150ºC (30 - 90s) Single Occurrence Maximum Temperature: 350ºC (at tip of soldering iron) Maximum Time: 3s Single Occurrence Figure 1 |
类似零件编号 - SM6002 |
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类似说明 - SM6002 |
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