IRFE9110

2

www.irf.com

Thermal Resistance

Parameter

Min Typ Max

Units

Test Conditions

RthJC

Junction to Case

—

—

8.3

RthJ-PCB

Junction to PC Board

—

—

27

Soldered to a copper clad PC board

°C/W

Source-Drain Diode Ratings and Characteristics

Parameter

Min Typ Max Units

Test Conditions

IS

Continuous Source Current (Body Diode)

—

—

-2.5

ISM

Pulse Source Current (Body Diode) ➀

—

—

-10

VSD

Diode Forward Voltage

—

—

-5.5

V

trr

Reverse Recovery Time

—

—

200

nS

Tj = 25°C, IF = -2.5A, di/dt ≤-100A/µs

QRR

Reverse Recovery Charge

—

—

380

µc

VDD ≤ -50V ➃

ton

Forward Turn-On Time

Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD.

A

For footnotes refer to the last page

Parameter

Min

Typ Max Units

Test Conditions

BVDSS

Drain-to-Source Breakdown Voltage

-100

—

—

V

VGS = 0V, ID = -1.0mA

∆BVDSS/∆TJ Temperature Coefficient of Breakdown

—

-0.08

—

V/°C

Reference to 25°C, ID = -1.0mA

Voltage

RDS(on)

Static Drain-to-Source On-State

—

—

1.2

VGS = -10V, ID = -1.6A➃

Resistance

—

—

1.38

VGS = -10V, ID = -2.5A ➃

VGS(th)

Gate Threshold Voltage

-2.0

—

-4.0

V

VDS = VGS, ID = -250µA

gfs

Forward Transconductance

0.9

—

—

S ( )

VDS > -15V, IDS = -1.6A➃

IDSS

Zero Gate Voltage Drain Current

—

—

-25

VDS= -80V, VGS= 0V

—

—

-250

VDS =-80V

VGS = 0V, TJ = 125°C

IGSS

Gate-to-Source Leakage Forward

—

—

-100

VGS =-20V

IGSS

Gate-to-Source Leakage Reverse

—

—

100

VGS =20V

Qg

Total Gate Charge

—

—

15

VGS =-10V, ID= -2.5A

Qgs

Gate-to-Source Charge

—

—

7.0

nC

VDS =-50V

Qgd

Gate-to-Drain (‘Miller’) Charge

—

—

8.0

Turn-On Delay Time

—

—

30

VDD =-50V, ID = -2.5A,

tr

Rise Time

—

—

60

VGS =-10V, RG =7.5Ω

Turn-Off Delay Time

—

—

40

tf

Fall Time

—

—

40

LS + LD

Total Inductance

—

6.1

—

Ciss

Input Capacitance

—

214

VGS = 0V, VDS = -25V

Coss

Output Capacitance

—

100

—

pF

f = 1.0MHz

Crss

Reverse Transfer Capacitance

—

20

—

nA

nH

ns

µA

Ω

Measured from the center of

drain pad to center of source

pad